Hi,
Which is the ball structure of the DM6467T BGA package?
1. SMD
2. NSMD
Please tell me the resist diameter and land (pad) diameter.
Best Regards,
Shigehiro Tsuda
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Hi,
Which is the ball structure of the DM6467T BGA package?
1. SMD
2. NSMD
Please tell me the resist diameter and land (pad) diameter.
Best Regards,
Shigehiro Tsuda
shigehiro tsuda said:Where is the description of Pad diameter: 0.58 mm?
I found that info in some internal TI communication.
Regards,
Pavel
Hi Pavel,
Thank you for quick reply.
I understood that it is TI internal information.
Best Regards,
Shigehiro Tsuda