SN74AVC16834: Footprint details (pad size, solder mask and paste mask) of part SN74AVC16834

Hello Narendra,

I have notified the appropriate applications engineer who will get back with you today on this topic.

Hi Narendra ,

what is the package that you are plan to use ? Do you need anything more than the details present at the end of the datasheet ?
I could find similar devices which might have the footprint details.

Hi Shreyas,

Details given datasheet is only for package, there is no details of footprint.

I need footprint related details as similar that is given in document DGG0056A. See attached document.

I use DGV package type (TVSOP)  56-pin in design .

Br / NarendraFootprint Refrence TSSOP-56.pdf

Hi Shreyash,

Thank you very much for sharing the document. Yes it answers my queries.

But I have a doubt about pad size (0.2mm) which is smaller in width as compared to maximum size of pin width (0.23mm)

Is that OK?

Also, why there are two methods of solder mask? In which situation other method "SOLDER MASK DEFINED" is used? Please, provide information in detail.

Br / Narendra