Hi Team,
My customer needs to learn if INA210BIDCKR is CUP structure (referring to active circuitry on the die underneath the bond pads) to recognize the material, please kindly help to provide the information.
Thanks.
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Hi Team,
My customer needs to learn if INA210BIDCKR is CUP structure (referring to active circuitry on the die underneath the bond pads) to recognize the material, please kindly help to provide the information.
Thanks.
Hey Charles,
I am looking into this and will respond as soon as I can.
Best,
Peter
Hey Charles,
The answer is yes, the active circuitry on die is underneath the bond pads.
Best,
Peter