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Hi Team,
Is there any recommended package size for OPA549S? My customer has never used a similar package before, and the recommended package size needs to be considered when making a PCB. Thanks.
Regards,
Charlie
The package size is specified on page 18 of the datasheet. Did you want to use a different word?
The KVC package appears to be designed for customers that want to do custom lead forming, according to their own requirements.
Hi Charlie,
As Clemens mentioned, these are available packages for OPA549.
Below is the current inventory status, unfortunately non of OPA549 packages are in stock.
https://www.ti.com/product/OPA549?login-check=true#order-quality
If you have additional questions, please let us k now.
Best,
Raymond
Hi Raymond and Clemens,
Thank you for your support. I have another question:
Is there any difference between the OPA549S on the EVM and the OPA549S on the official website? Do they all meet RoHS? Thanks.
Regards,
Charlie
What EVM? (The OPA547EVM, OPA548EVM, and TIPD138 reference design all use the T package.)
The chip is the same, but the EVM does not have any guarantees or qualifications.
Hi Charlie,
Is there any difference between the OPA549S on the EVM and the OPA549S on the official website?
Please see Clemens comments.
OPA549S's pinout is not compatible with OPA547/OPA548. You may find a way to "fit" OPA549S onto the EVM, but it is not a standard EVM configuration.
https://www.ti.com/tool/TIPD138
TI did not release OPA549S EVM officially. I may be able to find the recommended schematic for the part.
Do they all meet RoHS?
The package does not meet RoHS compliance requirements. The lead frame plating is still based on PbSn composition.
https://www.ti.com/materialcontent/en/report?pcid=32203&opn=OPA549S
If you have additional questions, please let us know.
Best,
Raymond