• State Resolved
  • Locked Locked
  • Replies 2 replies
  • Answers 1 answer
  • Subscribers 49 subscribers
  • Views 218 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

OPA549-HIREL: MSL not applicable to package type (KVC)

Alberto Moreno
Prodigy 10 points
Part Number: OPA549-HIREL

OPA549MKVC datasheet and TI website indicate that MSL is not applicable to its package type (KVC). Since it has a mold compound, I do not understand why it is N/A.

  • 0
    Guru 268200 points

    It is not applicable because during wave soldering, the solder touches only the leads on the bottom side of the board, but not the package.

    (If you are using intrusive soldering or pin-in-paste processes, then you might get the same moisture-induced failures as with SMT devices. But IPC/JEDEC J-STD-020 has no classification for that.)

  • +1
    TI__Guru 53251 points

    Hi Alberto, 

    Clemens explanation makes sense. The reasons that of the unspecified MSL is because this is considered a thru-hole package. The MSL ratings are established for SMD soldring process and does not apply to thru-hole packages. When going through Thru-hole components are typically soldered using wave soldering or hand soldering methods, which do not subject the components to the high-temperature reflow process that may cause moisture-related issues. 

    If you want to know the SML level, I compared the molding compound composition in OPA649-HIREL with OPA548F/500, and they are identical. So it is safe to say that the molding compound in OPA549-HIREL is likely similar to OPA548F/500 package, which the MSL is rated at Level-2-260C-1 Year. 

    If you have other questions, please let us know. 

    Best,

    Raymond