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LM393A: Solder Heat Resistance of DIP package

R.Fukunaga
Expert 1195 points
Part Number: LM393A

Hi all,

My customer would like to know solder heat resistance of DIP package.

I found the solder profile application report, but there is no mention of preheating or peak temperature.

Recommended Soldering Profiles (Rev. J) (ti.com)

Isn't there a report with flow conditions like SMT package? (see below)

Wave Solder Exposure of SMT Packages (ti.com)

I would appreciate it if you could tell me.

Best Regards,

Ryusuke

  • 0
    TI__Guru 52036 points

    Hello Ryusuke,

    Are they using Wave Solder or IR? I will assume Wave for a DIP package.

    TI follows the JEDEC J-STD-002 standard.

    Internally, this is what we are told to say:

    "At the present time there is not a JEDEC industry standard for recommended soldering profile for through-hole (DIP) packages. TI does perform a Solder Heat test in which the leads of the DIP devices are subjected to 260C solder for 10 seconds to ensure that they can withstand the heat of molten solder."

    Also see these appnotes:

    Absolute Maximum Ratings for Soldering (PDF, 5.4 MB)

    Handling & Process Recommendations (PDF, 324 KB)

  • 0 in reply to Paul Grohe
    Expert 1195 points

    Hi Paul.

    They use wave solder in their DIP package.

    My customer's solder requirements are as follows.

    1) Preheating 120~140°C/60 to 90 seconds

    2) Peak temperature up to 250°C/6 seconds

    I could not find the JEDEC J-STD-002 documentation you showed me.

    I'm sorry, but could you tell me where the soldering requirements for DIP package are listed?

    Best Regards,

    Ryusuke

  • +1 in reply to R.Fukunaga
    TI__Guru 52036 points

    Hello Ryusuke,

    All solder profile questions from customers should be referred to JSTD-020. Current rev is D. Unfortunately, I cannot provide the JEDEC document as this is a "paid-for" document and cannot be shared outside TI.

    Contrary to popular misunderstanding there is no “reflow profile” for a specific package. There are moisture classification restrictions for peak temperatures and time/temperature targets, all are defined in JDSTD-020.

    With that said, PDIP does not have a MSL rating, just a peak temperature (260C). Best to cautiously follow the JSTD for low MSL rating. There are several variables, so we cannot give a single number. The PCB manufacturer should be able to make the adjustments depending on their flow (hopefully they have a copy of the spec).