Hello,
I am looking to understand physical pressure induced characteristic changes in reagrds to the the following two Op Amps:
LMV551MG/NOPB and OPA314AIDCKR (SC70 Pacakges).
The circuit containing the Op Amp (one or the other) is potted/overmolded which results in potential pressures of several hundred psi and temperatures up to 100C. How does the mechanical stress affect both of these devices and is one better designed to handle the added stress? We have seen small voltage changes in the LMV551 after the molding process.
FYI... This issue was not originally present in our product (with the LMV551) until Jan 2012. Has there been any changes to the LMV551 over the last year?
Thanks,
Eric