OPA2333: Bare die version of OPA2333-HT Solder bumps and packaging

Mike Holladay74

Part Number: OPA2333

Does the bare die version of the OPA2333-HT Ti part # OPA2333SKGD1 have solder bumps or is it completely lead less ? Packaged as singulated device in a tray or tape ?

over 5 years ago

0 Alexander Davis over 5 years ago

TI__Expert 6250 points

Hi Mike,
Bare die are completely lead-less, without solder bumps. It's possible to get wafers or singulated die either in a tray or on tape and reel.

0 Dennis Goeke over 5 years ago in reply to Alexander Davis

TI__Genius 11135 points

Mike

We haven't heard back from you so we assume this answered your questions. If you need more help just post another reply below.

Thanks

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OPA2333: Bare die version of OPA2333-HT Solder bumps and packaging