INA129-HT: Bare die lifetime estimation

franziskus

Part Number: INA129-HT

Team,

is there an application report or similar resource to estimate the lifetime of INA129-HT in bare die applications?
My customer would appreciate any information about our experieces and recommendations.

Datasheet page 10, figure 1 shoes the operating life derating chart for D package. Wirebond failure mode seems to be limiting.
Is there background information how customers can avoid this limiting factor in their bare die applications?

Thanks!

over 5 years ago

0 Kirby Kruckmeyer96848 over 5 years ago

TI__Genius 17085 points

Figure 1 is what would be used for determining life.

I will see if there is any additional information and will get back to you by tomorrow.

Kirby

0 Kirby Kruckmeyer96848 over 5 years ago in reply to Kirby Kruckmeyer96848

TI__Genius 17085 points

Update: we do not have much more additional information.
This app note describes bond issues with gold bond wire.
www.ti.com/lit/SBOA150

Using aluminum bond wires eliminates those concerns.

Using hermetic packaging instead of plastic encapsulated packaging will increase gold bond wire life as will using a palladium doped gold bond wire.

Amplifiers

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INA129-HT: Bare die lifetime estimation