Other Parts Discussed in Thread: LF156, LM741
Dear All,
We are using LM111, LM101,LF156 and LM741 DIEs in one of our project.
We are facing issues as explained below
Processes undergone
1. All DIEs attached to alumina substrate and 1 MIL gold wire-bonded
2. Baking of unit(TI DIEs assembled) at 160-170degree Celsius for 24 Hours.
3. Stabilize bake @75 degree Celsius for 48 Hours
4. Thermal Cycling for all units of 30Min +85degree Celsius and 30Min -55degree Celsius like
this 10 cycles.
We are observing the repetitive failure of DIEs after completing the above mentioned ESS steps.
Please advice the reason for the DIEs failure.
Thanks