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THS4131: About the thermal pad on THS4131D(SOIC package)

Tao_2199
Genius 5660 points
Part Number: THS4131

Hello,

 

Regarding to the thermal pad on THS4131D, my customer is asking a question.

 

(Question)

Does THS4131D(SOIC package) have thermal pad?

If it doesn’t have thermal pad.

When it needs the thermal management, should they use external heatsinking or DGN package?

 

Regards,

Tao2199

  • 0
    TI__Genius 15975 points
    Hi Tao,

    The THS4131D (SOIC) package does not have a thermal pad, whereas the DGN package does.

    If the customer is concerned about thermal management, I would recommend on using the DGN package as it has the thermal pad and is easier to layout for conducting the heat out of the part.

    If the customer wants to stay with the D part, then using an external heat-sink would be helpful. They could directly solder a heat-sink to the bottom of the board. The only thing with heat-sink is that it is an additional component and sometimes the board being designed does not have enough headroom to incorporate a heat-sink for compactness.

    Best Regards,
    Rohit