LMX2615-SP: LMX2615-SP Flight Model's footprint verification

Hi Szymon,

I tried opening the zip file attached, but I received a message that I had "Unauthenticated access to record:  R6eNIxO3pGrADqnNwtMi35NQ93A1xe6GpSBV4GdNF8XTo0nEg4N9QmlMEmcMYdih". Can you try reattaching the file?

Thanks,

Michael

My bad, here is a google drive link with the footprint attached

drive.google.com/.../view

Hi Szymon,

Thank you for sharing that. I need to download KiCad, but I will look over your footprint and have feedback tomorrow.

Thanks,

Michael

Hi Szymon,

The footprint you shared does not reflect the flight model package dimensions. I have attached a footprint file that corresponds to the flight model.

https://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/48/LMX2615_5F00_flightmodel.kicad_5F00_mod

Thanks,

Michael

If this is the correct footprint, I would appreciate an explanation of how this component is mounted on the PCB. In the datasheet and in the 3D model you provided, the distance between the heat sink and the pin tip is approximately 5.44 mm, while in the footprint you provided, it is 4.25 mm. Does this mean that, because the heat sink protrudes from the bottom of the package, the pins are soldered at an angle?

 

Hi Szymon,

I was a bit low on bandwidth today, I will get to your question tomorrow.

Thanks,

Michael

Hi Szymon,

That is correct. The LMX2615's leads make a very slight angle with respect to the board, since the heat sink causes the leads to not be flush with the board itself.

You will need to line up all of the leads and the DAP, apply a bit of solder paste to your board, and then lower the chip into place. The leads should be pushed down so they make contact with their respective pads, and you can then solder them into place.

Thanks,

Michael

Do you happen to have an assembly video or any visual materials showing the recommended soldering process for the LMX2615? It would be really helpful to see how it's done, especially given the angled leads and the DAP.

Hi Szymon,

We do not have any supporting materials like you asked for. I found a YouTube video that I find to be particularly informative, particularly for how to deal with the DAP. With regards to the leads, they are gold, so they may be cut and formed as needed for the device footprint.

However, I understand quite well that the device with which you are working is quite costly. Dummy packages are available for the LMX2615-SP for the purposes of testing. I have attached a link to the list of available dummy packages here.

Thanks,

Michael