Other Parts Discussed in Thread: LMX2572
I would like to design something similar to the LMX2572EVM board, but with additional components for filter and amplification. I am reducing the size of the cavities to fit the components in housing as much as possible. I have found it would be of great benefit to place some of the supporting passive LMX2572 components on the backside of the board. I see in the datasheet that it's advisable to place some of the capacitors as close as possible to the pin. For pins where that isn't mentioned, I'm wondering about the consequences of placing these capacitors on the backside of the board, feeding the connection to a via, and then drawing a connection to the pin. Where indicated in the datasheet, it looks like I should keep the caps on the top layer for connection to CPout, VbiasVCO, and VregIN. However, for other components such as the VCC* pins and passive components related to other pins, I could place the components on the backside and feed the connection to the top layer with a via.
Do you see any issues with designing the board this way? Is there something about having any of the bypass capacitors on the backside of the board that could cause issues for any of the pins I have mentioned? Any insight into this is greatly appreciated.
