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AM26LV32E: Datasheet revision change(D -> E)

Kengo.Y
Guru 10575 points
Part Number: AM26LV32E

Hi team,

I'd like to know about the changes in the datasheet.

The following graphs have been changed.
Is this change due to a change in the design inside the IC?

Rev D


RevE


BR,
Kengo.

  • +1
    Guru 262920 points

    The move to 300 mm wafers involved a redesign of the die (PCN# 20230814006.1). Apparently, the new design has a higher drive strength. (The voltages are still inside the limits guaranteed by the datasheet, and the differences are noticeable only when you exceed the absolute maximum rating of 20 mA.)

  • +1
    TI__Mastermind 45847 points

    Hi Kengo,

    Yes - the redesigned version of this part does have a slightly higher drive strength - it is still bound by the same datasheet conditions that the legacy device is, but under typical operating conditions you may see a slight increase in drive strength.  We have noticed that the 300mm wafer updates do have some minor improvements - because our new process is better 

    I will note though that we still have a mix of older and newer material in circulation so customer may get older material still so any design should still be okay w.r.t. to max/min conditions listed in datasheet to ensure compatibility.


    There shouldn't be any issues using newer material in systems designed with the older material - but there may be some marginal improvements at a part level - but it probably won't be very noticeable at a system level. 

    Please let me know if you have any other questions!

    Best,

    Parker Dodson