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Part Number: LMH0387 Other Parts Discussed in Thread: LMH0397,
Our question: The pdf states that no metal / trace should be under the chip. Does this mean that the ground plane on inner layers and all layers must be open under the chip?
On inner layer under the device you can have GND or VCC. I would avoid fast slew rate signals though. I am not sure if you are aware but now there is next generation of the LMH0387 device part number LMH0397. This part is a monolithic device and you would not have this limitation.
