TLK10031: TLK10031 High/Low Speed Interface PCB Routing Rules

Mick Soriano

Part Number: TLK10031

For the TLK10031 low and high speed interfaces, the layout guidelines (Chapter 10) in the datasheet state "Differential intra-pair skew needs to be minimized to within ±1 mil.". Does this rule take into account the bond wire lengths inside the TLK10031 package? Or do I need to include the bond wire and PCB trace lengths in the 1 mil skew calculation? Is bond wire length data for the TLK10031 available?

over 3 years ago

0 Rodrigo Natal over 3 years ago

TI__Mastermind 19155 points

Hi,

The guidelines are specifically for system PCB layout. You only need to take your PCB trace lengths into account for the calculation. Given the package design on the TLK device (And any intrinsic skew at the die level), the additional intra-pair skew margin available for system PCB layout is +/- 1 mil.

Cordially,

Rodrigo Natal

HSSC Applications Engineer

0 Mick Soriano over 3 years ago in reply to Rodrigo Natal

Intellectual 290 points

Thanks Rodrigo!

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TLK10031: TLK10031 High/Low Speed Interface PCB Routing Rules