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SN54AHCT08-SP: CFP Package

Erin Yu
Prodigy 80 points
Part Number: SN54AHCT08-SP

Hi Mr./Mrs.,

We are using SN54AHCT08-SP in our design but have some question about CFP package. Could you please provide some suggestion?

1. Could you please provide CFP PCB layout Footprint suggestion?

2. Could you please provide PCB solder stencil and  paste suggestion for CFP Package? 

3. Becuase CPF pins are longer than general package, will you suggest to cut the pins shorter when soldering?

4. There is some gap between pin and the bottom side of IC, do we need to bend the pin when soldeing? If needed, could you please provide some instructions?

Thanks

  • 0
    Guru 258090 points

    The legs of the CFP package are supposed to be cut and formed, if necessary, by the customer.

    For a space-rated part, the customer requirements are likely to be so particular that a general suggestion by TI would not be helpful. See this question for what CFP users typically do.

    If you do not have any special mechanical requirements, the simplest solution might be to place the chip into a cutout in the board. But I do not know what your manufacturing constraints are.

  • 0
    Prodigy 80 points

    Hi Guru,

       Thanks for your reply about the mechanical part.

       Could you please help to provide the PCB layout design suggestion of CFP package including layout pattern, stencil, and solder paste?

    Thanks again.

      

  • 0 in reply to Erin Yu
    Guru 258090 points

    The pitch is the same as SOIC, so you can base your patterns on that.