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SN74AVC4T774-Q1: Need mechanical drawing for BQB package

Mark Whittington
Intellectual 480 points
Part Number: SN74AVC4T774-Q1
Other Parts Discussed in Thread: SN74HCS151-Q1, SN74AVC4T774

Tool/software:

Hello,

I'm looking to use the SN74AVC4T774-Q1. Specifically orderable device 74AVC4T774QWBQBRQ1. This is the BQB (WQFN) package. The datasheet does not contain any package information beyond the name of the package. When I go to TI's package search I find the BQB document,  but it also has no information about the mechanical dimensions. Link to the BQB package drawing: https://www.ti.com/lit/pdf/MPQF539

Can you please send me the BQB package drawing with dimensions?

In the meantime, I used the package search to find other parts that share the BQB package and used the SN74HCS151-Q1 datasheet for making the dimensions. Can you confirm the dimensions in that datasheet are the same as for the SN74AVC4T774-Q1 BQB package?

Thanks.
Mark

  • 0
    TI__Mastermind 29775 points

    Hi Mark,

    The AVC-Q1 data sheet is still in the APL phase and package information will be updated in data sheet once completed.

    However, BQB information is the same. You may also see the commercial version (SN74AVC4T774) for dimensions, thanks.

    Best Regards,

    Michael.

  • 0 in reply to Michael Ikwuyum
    Intellectual 480 points

    Hello Michael,

    What does that mean? I don't know what the 'APL' phase is. I am planning on using this part with that package in my design, is there anything I should be concerned about?

    Thanks.
    Mark

  • +1 in reply to Mark Whittington
    TI__Mastermind 29775 points

    Hi Mark,

    Apologies for the confusion and no concerns.

    The Q1 version is a new release to the market and undergoing an "Accelerated Product Launch". This is required for all new releases.

    During the APL phase, prototype builds can be ordered and once fully released to market, production builds can be ordered. This was completed Monday and data sheet will be updated momentarily, thanks.

    Best Regards,

    Michael.