Hi TI,
please provide the following information for PN SN74AHCT244MDWREP.
Assembly site:
Wafer fab site :
Mold compound:
Lead frame finish:
Bond Wires:
Thanks,
Daniel Sowell
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi TI,
please provide the following information for PN SN74AHCT244MDWREP.
Assembly site:
Wafer fab site :
Mold compound:
Lead frame finish:
Bond Wires:
Thanks,
Daniel Sowell
Hi Daniel,
Please use TI's Material content search for this information. I cannot provide any additional information to what's available here.
Thanks!
Chad Crosby
Daniel,
Mold compound, wafer fab site and assembly site is very proprietary, so we can't have on e2e. What is available is Lead frame finish: https://www.ti.com/product/SN74AHCT244-EP
Under ordering and quality, it says NiPdAu.
Another good resource is the following page: https://www.ti.com/applications/industrial/aerospace-defense/technical-documents.html
At the bottom, under "additional supporting literature."
https://www.ti.com/lit/ml/sszb156a/sszb156a.pdf - "Understanding Quality Levels for High Reliability Rated Components
https://www.ti.com/lit/sg/sgzt005b/sgzt005b.pdf - EP selection guide has a really good table of what's covered.
Under it states that we use gold bond wires as part of the V62 spec.
Regards,
Aaron