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MSP430FR6989: In the process of applying your company's MCU MSP430FR6989, there is a crash situation.

Bao Songhao
Intellectual 610 points
Part Number: MSP430FR6989

In the process of applying your company's MCU MSP430FR6989, there is a crash situation. At present, there is 1 case in production (16 cases in the same batch of production), and 3 cases have been found in field application.
The production of faulty MCU was analyzed and tested.
1. When the machine crashes, crystal vibration and power supply measurement are normal;
2, the PCB board of the faulty MCU and the normal MCU, MCU swap, found that the welding of the faulty MCU will also crash, and the normal MCU is still normal
3, the fault MCU is placed at low temperature, cold and heat exchange test, it is found that there is a high probability of crash when the temperature changes from -20 to 5, and the probability of crash is very small at the relatively stable temperature at normal temperature
4. Remove the faulty MCU program code for hibernation operation, and no crash has been found at present

Do you have any suggestions?

  • 0
    Expert 1270 points

    Since the crash occurs predominantly during temperature changes from -20 to 5 degrees Celsius, focus on analyzing the MCU's behavior and performance under these conditions. Consider using thermal imaging or temperature logging to monitor the MCU's temperature and identify any specific components or areas that might be affected. For your convenience, you can make a temperature logger like this: www.pcbway.com/.../Arduino_Temperature_Logger_With_Sd_Card_bdc658a9.html  Even though power supply measurements appear normal during the crash, it's essential to ensure that there are no transient voltage spikes or drops that could affect the MCU's operation during temperature changes. Check the power supply circuitry for any potential issues, such as insufficient decoupling capacitors or voltage regulators.

  • 0
    TI__Genius 11745 points

    Hi Bao,

    Bao Songhao said:
    2, the PCB board of the faulty MCU and the normal MCU, MCU swap, found that the welding of the faulty MCU will also crash, and the normal MCU is still normal

    I want to make sure the phenomenon: when tansfer the normal MCU to the fault board, and then the fault board is still fault. when transfer the failed MCU to the normal board, and the normal board is still working normal.

    If so, this means their should be some difference in these two boards.

    How you define the MCU cash? Maybe the MCU is normal but the output part has some issue and makes it behave like a crash situation.

    Bao Songhao said:
    4. Remove the faulty MCU program code for hibernation operation, and no crash has been found at present

    So, for the failed board, if you delete the hibernation operation, then it behaviors like a normal one.

    This might tell that with the hardware environments makes the impact with low power wake up, I suspend it might be relevant to the crystal.

    B.R.

    Sal

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