Hello, I am planning to use 5962R1022102VSC (TPS50601A-SP) in a space application. I am confused about the package size.
- The TI datasheet gives the HKH0020A package outline with the thermal pad outline included. There is a note saying that it falls within MIL-STD-1835 CDFP-F11A.
- The DLA datasheet specifies the case outline to be CDFP3-F20 and does not provide any outline for the thermal pad.
These two packages are not equivalent. Which is correct?
If the DLA datasheet is correct, what is the recommended thermal pad dimensions?
Also, is there any flexibility on the diameter of the thermal vias? The TI datasheet recommends 0.2mm (~80 mils); what would be the effect of increasing the diameter to, say, 120mils?