HI, the question is not related to the reflow phase but on the PCB layout.
In the component datasheet you have this figure as a layout example
There is no thermal relief on the pad. Do you recommend NOT to use the thermal reliefs?
Thanks
Franco
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HI, the question is not related to the reflow phase but on the PCB layout.
In the component datasheet you have this figure as a layout example
There is no thermal relief on the pad. Do you recommend NOT to use the thermal reliefs?
Thanks
Franco