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Tool/software:
The customer would like to design in the TPSM41625, but their factory automation team has some concerns/questions.
Can you please make recommendations on the best pick/place center of gravity for this device, per the customer:
Hi,
If I am not mistaken you are looking for 3d model, customer can get that at product page in the TI.com
Thank you
Savith
No; This is regarding pick and place operation during board assembly. They need to know where is the best location on the device to place it reliably.
Team-
The customer has received samples of this part and are trying to figure out how to use their placement equipment to manufacture with it.
They are asking if there is some sort of cover that is available to make this operation easier.
A timely response would be most helpful.
Thanks!
-Steve
Hi Steve,
I am checking with the product engineering and packaging team to see if I can get a better solution
In the mean time I found an e2e post which may help,
may be we can use inductor surface to pick and place the component as suggested in the above post,
but need couple of days to get suggestions from other teams
Thank you
Savith
Yes, I'm assuming the inductor is the heaviest device, as well as the tallest, and it makes sense to pick up the module via the surface of the inductor.
The datasheet for the device doesn't show a pick up area as shown in the LMZM23600 thread- that's what were looking for.
Thanks!
-Steve
Steve,
Inductor is the best place to pick and place the Module.
Inductor used in this module is XEL6030-281ME you can check the manufacturer dimensions @
https://www.coilcraft.com/getmedia/ed8d0314-5cbb-4be3-85da-32235c3701c8/xel6030.pdf
Thank you
Savith
The customer's factory automation team had this feedback, see especially the feedback about the sticker that's attached to the inductor. Please let me know what other tips tricks you know and/or what feedback may have been received from other customers using this part:
The offsets required are a bit larger than preferred with most components, but with some notes in the work instructions and fine tuning we should be able to place this component. There is increased risk on this component for misalignment and droppage with our equipment; facilities with newer equipment may have fewer concerns.
We need to pick/place using the QFN that is slightly off-center to avoid vacuum leaks caused by the sticker on top of the Inductor. I am still going to need to fine tune this part if approved, and without a board I cannot definitively say it will place perfectly. I would not recommend this component, but if it is our only option we will do our best. …If this component does need repair, the stack up of components may require special procedures/stencils.
Hi Steve
I am checking with the PE team and will get back to you by Wednesday
Thank you
Savith
Hi Steve
We can either use Inductor or IC for pick and place, as these 2 have largest surface area and more centered on the module
Recommendation is to use the IC as it is closer to the center of the module , they need to select the right nozzle size, machine vision system should be able to compensate for the offset when placing. If sticker on inductor is causing some leaking issues they may need to select a bigger nozzle.
Thank you
Savith