Other Parts Discussed in Thread: AM62A3, AM62A7-Q1, AM62A3-Q1, AM62A7, AUDIO-AM62D-EVM, SYSCONFIG
Tool/software:
Hi TI Experts,
Can you provide a List of collaterals that can be referred when starting a custom board hardware design.
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Hi Board designers,
AM62D-Q1 processor family is available on TI.com and is in preview.
The below links are a quick reference to the collaterals that can be referred when starting a custom design.
Device Selection and features
Product Pages
https://www.ti.com/product/AM62D-Q1
Datasheet
AM62Dx Sitara Processors datasheet
https://www.ti.com/lit/pdf/sprspb5
Silicon Errata
AM62Dx Sitara Processors Silicon Errata, Silicon Revision 1.0
https://www.ti.com/lit/pdf/sprz580
Technical Reference Manual (TRM)
AM62D Sitara Processors Technical Reference Manual
https://www.ti.com/lit/pdf/sprujd4
Custom Board design:
Hardware Design Considerations
Custom Board Hardware Design Considerations for AM62A3, AM62A7-Q1 and AM62D-Q1 Processor Families
Schematic Design and Review Checklist
For AM62x processor families
AM62x, AM62Ax, AM62D-Q1 and AM62Px Processor Families Schematic, Design Guidelines and Review Checklist
https://www.ti.com/lit/pdf/sprad21
For AM62Ax and AM62Dx Processor Families
AM62A7, AM62A7-Q1, AM62A3-Q1 and AM62D-Q1 Families Schematic, Design Guidelines and Review Checklist
https://www.ti.com/lit/pdf/sprado2
Power Consumption
AM62Ax Maximum Current Ratings
https://www.ti.com/lit/pdf/sprada7
AM62D Power Estimation Tool
https://www.ti.com/lit/pdf/sprado7
Evaluation - EVM
https://www.ti.com/tool/AUDIO-AM62D-EVM
AUDIO-AM62D-EVM Design File Package
https://www.ti.com/lit/zip/sprcal5
Board Dimensions 2D
Board Stackup
AUDIO-AM62D-EVM Design File Package
Gerber files - PDF
Schematics (Reference) for RMII interface
Note: We did functionally validate the common clock configuration. No other clocking options were tested.
Ethernet PHY daughter card
https://www.ti.com/tool/DP83867-EVM-AM
https://www.ti.com/tool/DP83826-EVM-AM2
https://www.ti.com/tool/TIDA-00928
There seems to be a muxed GPMC interface implemented.
https://media.digikey.com/pdf/Data%20Sheets/Texas%20Instruments%20PDFs/TMDXICE3359_SCH.pdf
CAD symbols
Cad symbol specific to the selected device can be chosen from the device product page. Refer below example.
https://www.ti.com/product/AM62D-Q1#cad-cae-symbols
Ordering & quality
https://www.ti.com/product/AM62D-Q1#order-quality
DDR Board Design and Layout Guidelines
AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines
https://www.ti.com/lit/pdf/sprad66
Escape Routing for PCB Design
AM62Ax/AM62Dx Escape Routing for PCB Design
https://www.ti.com/lit/pdf/spruj81
Design Simulation files
https://www.ti.com/product/AM62D-Q1#design-tools-simulation
Simulation files provided includes IBIS, IBIS-AMI, BSDL, Thermal model and power-estimation tool (PET)
AM62D-Q1 PDN Target impedance values:(Same as AM62Ax)
| Voltage Rail | Freq Range | Target Impedance (mOhms) |
| VDD_CORE (0.75V) | Low (< 1MHz) | 7.0 |
| Mid (1 - 20 MHz) | 11.7 | |
| High (20 - 50 MHz) | 23.4 | |
| VDD_CORE (0.85V) | Low (< 1MHz) | 6.9 |
| Mid (1 - 20 MHz) | 11.4 | |
| High (20 - 50 MHz) | 22.9 | |
| VDD_DDR (1.1V) | Low (< 1MHz) | 104.5 |
| Mid (1 - 20 MHz) | 174.2 | |
| High (20 - 50 MHz) | 348.3 |
For frequencies above 50 MHz the board decoupling caps do not play a critical role. SoC and Package decaps (if any) will be dominant beyond 50 MHz
Note: We do not include Buck output inductance in PDN simulations.
Note 1: For VDDS_DDR: we do not recommend using target impedance as the signoff..
Refer to the AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines which outlines all details of power aware SI/PI simulations that need to be run. The eye mask checks from these power aware simulations are the signoff.
We only provide impedance targets for VDD_CORE. This information can be found under processor specific section "Example:AM62Ax" (starting on page 31) in the following document: www.ti.com/.../sprac76
As noted in the document, rails not listed are not simulated by TI due to low load transients. For more information, see the device-specific EVM layout for example implementation of these rails.
Other rails like the IOs are highly dependent on external peripherals. From the SoC perspective, if you look at the MAX current ratings for the IOs, the total current (after combining all the IOs of the same voltage) is still very low < 350mA so we don't simulate this rails/No data available.
Regarding your other questions related to PET, the supply names are not expected to match with processor (Example AM62A) pin names because the power estimates in the PET are itemized by supply groups. The power supply consolidation for these supply groups match the EVM.
Power Distribution Networks: Implementation and Analysis
Sitara Processor Power Distribution Networks: Implementation and Analysis
https://www.ti.com/lit/pdf/sprac76
High Speed Board design and Signal integrity simulation
https://www.ti.com/lit/pdf/spraar7
https://www.ti.com/lit/pdf/spracn9
SYSCONFIG
DDR subsystem register configuration tool
Technical Documents
Collaterals and application notes
https://www.ti.com/product/AM62D-Q1#tech-docs
Technical Support
AM62D-Q1 Custom board design - FAQs
Previous E2E threads - Keywords AM62Dx, AM62D-Q1
Starting a new thread
Useful links
Notes
Regards,
Sreenivasa
Hi Board designers,
Inputs regarding Package shelf life
Please refer below links
https://www.ti.com/support-quality/quality-policies-procedures/product-shelf-life.html
https://www.ti.com/support-quality/faqs/product-shelf-life-faqs.html
https://www.ti.com/support-quality/reliability/reliability-home.html
https://www.ti.com/lit/an/spraby1a/spraby1a.pdf
https://www.ti.com/lit/pdf/snoa550
https://www.ti.com/lit/an/slva840/slva840.pdf
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Regards,
Sreenivasa