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Hi,
I want to ask some question about TDA4 boot.My sdk is V7_01
as you know,
mehtod 1 : we can load mcu1_0 through A72 UBoot(tiboot3.bin tispl.bin u-boot.img sysfw ),and load other core firmware .
mehtod 2 : also,we can load mcu1_0 through SBL,it can quickly response can.
My question is
1, CAN quilcyly responese aslo can do in mehtod 1,when load mcu1_0 in the uboot ,and i found other core can work maybe more quickly.
why need sbl start,Is it has some reason.
2, In my last product,TI suggest which boot way.
As you have mentioned there are two available boot flows provided by the J7 SDK:
Additional documentation the flows are available at SBL and SPL.
By default SBL is more likely to boot faster than SPL, as SBL contains less features, however, either boot flow can be customized to meet requirements. Providing a recommendation on which boot flow is more appropriate is not possible without a full understanding of the product, including, but not restricted to, early boot metrics, image sizes, filesystem, and boot media that are being used.
Please follow up with your local TI representative, for assistance with this.
Regards,
kb
HI,thanks!
in the method1,I dont found about the funtion X509 module, Is it necessity to boot through it? can I think SBL boot more secure ,but it will lower the speed because mcu read file is slow compare to A72 UBOOT readfile. I find sbl copy file & mutiproc core is at least 10s, and LINUX kernel is start too long.
The X509 certificate is required for TDA4VM HS - High Security devices, it is not required for TDA4VM GP - general purpose devices.
Regards,
kb
thank you!
another, as you know VSDSK7.1 is not support SBL from EMMC, which version support SBL from EMMC.