Simulation files provided includes IBIS, IBIS-AMI, BSDL, Thermal model, power-estimation tool (PET) and SK-AM62A-LP Design File Package (Assembly drawing).

AM62Ax PDN Target impedance values:

Voltage Rail	Freq Range	Target Impedance (mOhms)
VDD_CORE (0.75V)	Low (< 1MHz)	7.0
	Mid (1 - 20 MHz)	11.7
	High (20 - 50 MHz)	23.4
VDD_CORE (0.85V)	Low (< 1MHz)	6.9
	Mid (1 - 20 MHz)	11.4
	High (20 - 50 MHz)	22.9
VDD_DDR (1.1V)	Low (< 1MHz)	104.5
	Mid (1 - 20 MHz)	174.2
	High (20 - 50 MHz)	348.3

Note: We do not include Buck output inductance in PDN simulations.

Power Distribution Networks: Implementation and Analysis

Sitara Processor Power Distribution Networks: Implementation and Analysis (Rev. F)

High Speed Board design and Signal integrity simulation

https://www.ti.com/lit/an/spracn9d/spracn9d.pdf

https://www.ti.com/lit/an/spraar7i/spraar7i.pdf

SYSCONFIG

DDR subsystem register configuration tool

interactive and intuitive graphical tool for enabling, configuring and generating initialization code for device pin multiplexing

Technical Documents

Collaterals and app notes

https://www.ti.com/product/AM62A3#tech-docs

Technical Support

AM62A3, AM62A3-Q1 Custom board design - FAQs

Previous E2E threads - Keywords AM62Ax, AM62A3, AM62A3-Q1

Starting a new thread

(2) TI E2E support forums

Useful links

(21) [FAQ] What is the difference between RMII slave signaling and RMII master signaling? - Interface forum - Interface - TI E2E support forums

Notes

Always ensure you are using the latest version of the documentation.
Check the product folder regularly for the latest version.
On Ti.com, device product folder page, there is a "Notifications" button. Registering here enables automatic notification of device document changes.
If you have any queries or clarification, use E2E to find similar queries or ask a new question.

0 Kallikuppa Sreenivasa 4 months ago in reply to Lavanya M R

TI__Guru**** 159609 points

Hi Board designers,

Additional inputs:

Could you help to provide Pinmux excel file for AM62A?

SysConfig Tool export csv file does not list MUX Mode.

TDAV4VM provides MUX Mode

The Excel has been generated and is attached here.

(30) AM62A7: Could you help to provide Pinmux excel file for AM62A - Processors forum - Processors - TI E2E support forums

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa 4 months ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 159609 points

Hi Board designers,

Additional inputs:

AM62P5-Q1: Ball material (wt%)

I am unable to find the information about ball material(with wt%) for AM62P52ASMSIAMHRQ1
in the latest datasheet.
Could you please share this information?

Sn wt%
Ag wt%
Cu wt%
Bi wt%
?? wt%
?? wt%

Please refer below inputs i received:

Solder ball is :

96.5% Sn

3.0% Ag

0.5% Cu

Ball Diameter 0.4mm

The information is expected to be published after the release of the product.

Regards,

Sreenivasa

0 Kallikuppa Sreenivasa 25 days ago in reply to Kallikuppa Sreenivasa

TI__Guru**** 159609 points

Hi Board designers,

Additional inputs

Could you provide following information of our AM62A12AQMSIAMBRQ1?

1. BGA PAD Material

2. BGA solder Ball material.

3. IC Pad type, is it SMD or NSMD?

Below is the related info we're looking for.

AM62A74AUMSIAMBRQ1 - the below is it’s Quality, reliability & packaging data information

https://www.ti.com/quality-reliability-packaging-download/report?opn=AM62A74AUMSIAMBRQ1

.AM62A74AUMSIAMBRQ1.pdf

AM62A12AQMSIAMBRQ1 - the same information could be used as it is likely that there is no difference between the 2 devices for the

Quality, reliability & packaging data information

We're asking about the IC's(SoC) PAD.

Please refer below

AM62A – AMB pkg

BGA PAD Material : Pad material is Cu, pad finish is OSP
BGA solder Ball material: SAC305
IC Pad type, is it SMD or NSMD?: SMD

Regards,

Sreenivasa