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TDA4AL-Q1: Heat Dissipation

HyunJae Yu
Prodigy 10 points
Part Number: TDA4AL-Q1
Other Parts Discussed in Thread: TPS62873, TPS62871

Hello.

My name is HyunJae Yu and I am Automotive HW Engineer.

I am developing the new product by using the TDA4AL-Q1.

Recently I have done Thermal Analysis about my ECU.

But, the result is fail.

(I want show the result by image but I can't upload the image because of the company security policy.)

The bigget reason for fail is that TDA4AL is using too much Power.

(1) TDA4AL Thermal Power

I receive the file "J721S2PowerEstimationTool_v0p2.xlsm"by FAE.

I select the Use Case "UC-FUS-8MP_Front_3MP_Rear."  and total power Thermal power is about 11W. It's too big.

(2) TI's Power Solution

I heard that TDA4AL generates a lot of heat from other HW team.

And when I check the Jacinto7 J721S2 Pwr Solution, Power IC output current is very high.

(For example)

- TPS62873 : 15A

- TPS62871 : 18A (9A * 2EA)

(3) 12V current

When I check the main input 12V current, TDA4AL is using more & more current than other company AP even if there is no Logic SW in the TDA4AL.

- TDA4AL : about 600mA (No Logic SW in the AP. Maybe only Driver SW is including / Uart, I2C, EMMC and so on.....)

- Other company AP : about 300mA (Full SW in the AP including the Logic SW)

** If Logic SW is used in the TDA4AL, current will be more increase than 600mA.

When I consider the above point,

I think that TDA4AL is not suitable for Automotive.

If I use the TDA4AL for automotive, do I have to use the any special structure for Heat Dissipation?

So, can you check other automotive product (using TDA4AL) information including Heat Dissipation Structure?

  • 0
    Prodigy 10 points

    I missed the Temperature condition

    Heat Analysis Temp. condition

    1) Ambient Temp (Ta) : 85℃

    2) Junction Temp Result : 135℃ 

    - Spec : 125℃ 

  • 0 in reply to HyunJae Yu
    TI__Mastermind 49082 points

    Hello HyunJae,

    We do have other customers using our part successfully in automotive, with a similar Ta spec.  

    Although the thermal designs of different customers are proprietary, the usual design pattern is to use a metal box that is shaped to act like a heat sink for the SoC.  The metal of the chassis/heat sink should touch the lid of the SoC with some thermal interface material to help make contact and to allow heat to spread from the SoC to the chassis/heat sink. The chassis/heat can have fins to give the maximum surface area to allow heat to dissipate into the surrounding environment.

    Regards,

    Kyle