Hi TI Team
For BGA soldered shorts issue. TI BGA recommended stencil design is: 0.125mm thickness and Balls solder mask opening is:0.25 mm.
Due to U5 EMMC same as BGA ball and pitch . We suggest stencil design is:0.10mm and balls solder mask opening is:0.28mm.
Pls help comment if there is any affact to use our design stencil.Thank you!
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From datasheet |
BGA Recommended Stencil design |
WONGS Stencil design |
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Side |
Location |
BGA Welco P/N |
Manufacturer P/N |
Manufacturer P/N |
BGA |
BGA ball diameter(mm) |
Package Pad Dia (mm) |
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Aperture |
Stencil thickness |
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Pitch |
THICK STENCIL |
SOLDER MASK |
(Circle, mm) |
(mm) |
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(mm) |
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A |
B |
C |
E |
F |
G |
H |
I |
J |
K |
J |
K |
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Side B |
U1 |
30762320R2F |
AM6232ATCGHAALW |
TEXAS |
0.5 |
0.25~0.35 |
13*13 |
0.125 |
0.25 |
0.32 |
0.1 |
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Side B |
U5 |
30781010R1F |
KLM8G1GETF-B041008 |
SAMSUNG |
0.5 |
0.25~0.35 |
11.5*13 |
No data in datasheet |
No data in datasheet |
0.32 |
0.1 |
