PROCESSOR-SDK-J721E: Fill pattern in linker script.

Part Number: PROCESSOR-SDK-J721E

Tool/software:

Hi TI team, I modified a linker script for a new application in core MCU3_0 and is working well but I have a question regards the fill pattern define.

I saw the next defines 

--define FILL_PATTERN=0xFEAA55EF
--define FILL_LENGTH=0x100

That were used in the linker as follows.

/* Additional sections settings */
McalTextSection : fill=FILL_PATTERN, align=4, load > DDR0
{
.=align(4);
__linker_can_text_start = .;
. += FILL_LENGTH;
*(CAN_TEXT_SECTION)
*(CAN_ISR_TEXT_SECTION)
.=align(4);
. += FILL_LENGTH;
__linker_can_text_end = .;
}

My question is why FILL_PATTERN is =0xFEAA55EF? and Could I use another different value?

Best regards

Eduardo