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Issue building Window CE 6.0 BSP for the AM1808 or OMAP-L138

Gerry Simmons
Intellectual 875 points
Other Parts Discussed in Thread: AM1808, WINCESDK-AM1XOMAPL1X, OMAPL138, OMAP-L138

I have a customer that has had issues with the Windows CE SDK download package from the AM1808 Product Folder reference to WINCESDK-AM1XOMAPL1X.

 

He downloaded the OMAP_L13x_AM1x_WINCE_ARM9_Source_01.00.00_setup.exe file and installed these sources. He followed the AM18x_OMAPL138_WinCE_6.0_BSP_Quick_Start_Guide.pdf in the "doc" folder, and double-checked that he had all the required Visual Studio 2005 and WINCE 6.0 Platform Builder installs and updates, and he gets the following build errors when he attempts to build this package: 


"Here is the contents of the build.err file:"


BUILD: [Thrd:Sequence:Type  ] Message

BUILD: [01:0000000221:ERRORE] C:\WINCE600\public\common\oak\misc\makefile.def(3254) :  U1033: syntax error : 'C:\WINCE600\PLATFORM\COMMON\SRC\SOC\OMAPL13X_TI_V1' unexpected

BUILD: [01:0000000223:ERRORE] NMAKE.EXE WinceTargetFile0  -i -c BUILDMSG=Stop.  BUILDROOT=C:\WINCE600\PLATFORM\COMMON CLEANBUILD=1 NOLINK=1 PASS0ONLY=1 failed - rc = 2


Has anyone else experienced this issue?   Anyone Building WinCE for the AM1808 or OMAP-L138??

  • 0
    TI__Intellectual 1640 points

    Hello Gerry,

    1.  Which OSDesign is your customer trying to build?

    2.  Did your customer accidentally modified some WinCE public files?

    3.  Can he issue "Build > Clean Solution" before issuing "Build > Rebuild Solution", just in case?

    3.  If possible, can he try it on a different machine with WinCE installed?

    4. Can he post the end portion of Build.log.  It may contain more info on the build progress.

     

    Regards,

    WM

  • 0 in reply to WMK
    Intellectual 875 points


    1.  Which OSDesign is your customer trying to build?

    OMAPL138_AM18X_SAMPLE.sln

    OMAPL138_AM18X_TI_DEFAULT.sln              yields the same result

    2.  Did your customer accidentally modified some WinCE public files?

    No.  I copied the files (twice) according to the Quick Start Guide:

    Move the OS designs and BSP platform files into the relevant locations for Windows

    Embedded CE 6.0:

    · Move extracted folder: PLATFORM\OMAPL138_AM18X

    To: C:\WINCE600\PLATFORM\

    · Move extracted folder: PLATFORM\COMMON\SRC\SOC\OMAPL13X_TI_V1

    To: C:\WINCE600\PLATFORM\COMMON\SRC\SOC\

    · Move extracted folders: OSDesigns\OMAPL138_AM18X_SAMPLE

    OSDesigns\OMAPL138_AM18X_TI_DEFAULT

    To: C:\WINCE600\OSDesigns\

    3.  Can he issue "Build > Clean Solution" before issuing "Build > Rebuild Solution", just in case?

    DONE.  Same result.

    3.  If possible, can he try it on a different machine with WinCE installed?

    I hope I don’t have to do this one…, but I will if necessary.

    4. Can he post the end portion of Build.log.  It may contain more info on the build progress.

    Attached:  Build – 2nd half.log

     

    Note:  This is the 2nd BSP installed on this workstation.  I also have MPC Data’s BSP for the Hawkboard installed.  The Hawkboard build completed without errors on a previous project.  The Quick Start Guide example shows a number of BSPs installed under WINCE600.8032.build - 2nd half.log

  • 0 in reply to Gerry Simmons
    TI__Intellectual 1640 points

    the file platform\common\src\soc\dirs includes compiling all soc sub-directories in the build

    try either one of the following and do a "Clean Solution" then "Rebuild Solution" to see if it helps:

    1.  modify platform\common\src\soc\dirs such that it has one single line:

                DIRS=OMAPL13X_TI_V1

    2.  temporarily move all soc sub-directories, except OMAPL13X_TI_V1, to another location

  • 0 in reply to WMK
    Intellectual 875 points

    OK. We got it going and successfully built the CE image files.

    We're having some difficulty getting it to boot on the AM1808 Experimenters board. Can someone enlighten us on what we need to do? (i.e. burns these files onto an SDCard, burn the bootloader and kernel into on-board flash, etc.)

  • 0 in reply to Gerry Simmons
    TI__Intellectual 1640 points

    In section 7.1 "Flashing EBOOT to Serial Flash" on the same AM18x_OMAPL138_WinCE_6.0_BSP_Quick_Start_Guide.pdf , you should find the steps on how to flash the bootloaders to the board.  Following sections show you how to start configure eboot and start kernel etc.

    If you are using AM1808 Experimenters board, it may have only 64 MB DDR.  Please check the kit's documents. 

    There is a known issue that the current WinCE BSP release does not support 64 MB DDR.  A patch to the WinCE BSP has been posted to another thread on the FORUM here: http://e2e.ti.com/support/embedded/f/353/p/67106/243022.aspx#243022.   After applying the patch, do a "Clean Solution" and "Rebuild Solution". 

    The Readme.txt file in the patch gives more details on how to install, compile, and flash bootloaders compiled from this patch.   Take special note about  section Usage step 4 in the Readme.txt file when you flash the bootloaders compiled from the patch.

    As indicated in the release notes, known issues are posted to https://cqweb.ext.ti.com/cqweb/main?command=GenerateMainFrame&service=CQ&schema=SDOWeb&contextid=SDOWP&queryID=34371716&username=readonly&password=readonly. 

    The 64MB DDR issue is SDOCM00073692 on the list.  You can find more details about the issue there.

    Hope this helps.

    By the way, could you share with us how you fix the build issue so that we can document it and improve in future releases.

    Thanks

    WM