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Hello,
I have a customer who's experiencing DDR failures on some of their prototype devices with the AM3352. Although not all devices will crash, some will after the customer application has been running a while which indicates some issues with heating. The customer has also been able to specifically heat the DDR chip with a heat gun and cause devices to fail.
Customer is using the ISSI IS43TR16256A-125KBL DDR3 SDRAM.
I have attached the DDR worksheet for the AM335x that the customer has filled out, any feedback on any parameters that could be improved woud be great!
Thanks,
Hi Biser,
Agree that a thermal chamber is better, but the point is that failure happens over time in regular operating conditions as well (room temp ambient), and customer could accelerate that failure by increasing the heat on the DDR section.
Thanks,
Munan