Our customer have the following question on the maximum pressure the AM5728BABBCXA can handle:
1) The maximum pressure the BGA balls can handle both individually and uniformly? Do we have a document to support this?
2) What about the circuits, silicon items, others hidden under the stainless steel cover? Are they not affected with the maximum allowable pressure applied on top of the package
We found below e2e post but can you help confirm?
Thanks to clarify!