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Frequent questions

  • [FAQ] AM6442: Enabling SOP8 208mil and SOP16 300mil Co-Layout for Winbond Flash in a Single PCB Design

    Part Number: AM6442 Just a quick information share for anyone who may encounter a similar situation. I recently heard from a designer working on an AM6442-based project who faced a PCB layout challenge due to component sourcing flexibility requirements…

  • [FAQ] J784S4XEVM: RAT configuration for Jacinto platforms

    Part Number: J784S4XEVM RAT configuration from simple example

  • [FAQ] 3D CNN / Pooling TO 2D CONVERSION FOR TIDL

    Part Number: PROCESSOR-SDK-RTOS-J784S4 OVERVIEW TIDL's C7x DSP only runs 2D convolution and 2D pooling. This tool rewrites Conv3D, MaxPool3D, and AveragePool3D nodes in an ONNX model into equivalent sequences of 2D operations. The conversion is mathematically…

  • [FAQ] AM625: errata i2493 potential of eMMC write failures fix

    Part Number: AM625 Background: i 2493 MMCSD: HS200 write failures Details: The MMC0 interface has the potential for write failures when issuing multiple block writes operating in HS200 mode with excessive IO supply noise. To minimize IO supply noise…

  • [FAQ] J784S4XEVM: Automatic Mixed Precision Runs Very Slowly and Generates Large Intermediate Files

    Issue When running Automatic Mixed Precision (AMP) with TIDL, users may observe: - AMP runs for an extremely long time without completing - Hundreds of gigabytes of intermediate trace files accumulate on disk Root Cause AMP works by running the…

  • [FAQ] J721S2XSOMXEVM: Migrating to c7x-mma-tidl 11.02 on SDK 11.00

    Overview This guide covers a component-level upgrade, replacing the c7x-mma-tidl and mmalib packages inside an existing SDK 11.00 build environment, without fully migrating to SDK 11.02. It also updates the targetfs runtime libraries (onnxruntime, TFLite…

  • [FAQ] AM625 / AM623 / AM625-Q1 / AM620-Q1 / AM62L / AM62A / AM62P / AM62D-Q1 / AM64x / AM243x Custom board hardware design – Queries related to UART, MCSPI, MCAN peripheral instances and interfaces

    Part Number: AM625 Other Parts Discussed in Thread: AM62P-Q1 HI TI experts: I am designing a custom board with UART, MCSPI and MCAN interfaces. Please let me know if you have any design recommendations. Regards,

  • [FAQ] TDA4VH-Q1: Board Configuration for ECC test on NAVSS Inaccessible RAMs

    Part Number: TDA4VH-Q1 Other Parts Discussed in Thread: SYSCONFIG Please share the details required to update board configuration to be able to test ECC on the Main NAVSS inaccessible endpoints from the MCU R5F.

  • [FAQ] PROCESSOR-SDK-AM62X: How to Enable and Use TMP100 temperature sensors on AM62x EVMs

    Part Number: AM625 Other Parts Discussed in Thread: TMP100 , AUDIO-AM62D-EVM , SK-AM62A-LP , SK-AM62B-P1 , SK-AM62-LP , SK-AM62P-LP , TMDS62LEVM , TMDS64EVM TMP100 is an I2C/SMBus interfaced digital temperature sensor that is available on the EVMs…

  • [FAQ] How to build, flash and boot Linux from GPMC-NAND on AM64x

    Part Number: AM6442 Other Parts Discussed in Thread: TMDS64EVM The FAQ lists steps on how to build, flash, and boot linux from GPMC-NAND on TMDS64EVM [1] and [2] with AM64x Linux SDK 12.1.0.5.3 [3] + the attached u-boot and kernel patches. [1]. TMDS64EVM…

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