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CD4051B: CD4051BM96 Consulting marking

Part Number: CD4051B

Tool/software:

Hi

This product is commonly used by us. We have found that the printing fonts on this product purchased by your company are inconsistent every time. Could you please help confirm the reason

Thank  you

  • There are multiple assembly locations for this device (see ti.com/material-attributes-search/?material=CD4051BM96). This is field 22L on the shipping label.

  • Hi

    Origin is not the same, the internal crystal source will be different

  • Hello Yingjiao,

    I reached out to our internal packaging team with your concern. 
    Please expect a reply early next week.

    Thanks,

    Nir 

  • Hi
    Origin is not the same, whether the function and performance of the product are different

  • Hello Yingjiao,

    I have received a response from the packaging team. 

    The reason the prints are different is because they were manufactured in different sites.
    The print indicates the date code, lot code, and site. 

    Thanks,

    Nir 

  • Hello

    So this origin is different, the function and parameters will be different?

  • Hello Yingjiao,

    While the devices were manufactured in different sites, their functionality and behavior will be identical.

    Thanks, 

    Nir

  • Hello

    We have the following questions about this product:
    1. How many producing areas are there for this material?
    2. Are all these producing areas in production? Or will there be only one origin in the future
    3. We saw a PCN, which told us not only the origin problem, but also the wafer change. So Mexican origin wafer and Malaysia wafer is the same wafer? What's the difference?
    4. How do we verify the static electricity of the product?
    5.wafer is different, is there any difference in product performance?

    Please help confirm the above information
    thank you

  • Hello Yingjiao,

    Please see answers below.

    1. This is internal information, do you have an NDA with TI?

    2. Currently and in the near future there will be multiple producing origins in production. 

    3. No difference in the wafer, only in origin.

    4. Can you please explain what do you mean by static electricity? Do you mean ESD (electric static discharge)?

    5. There will be no difference in product performance and behavior.

    Thanks,

    Nir  

  • Hi

    I have not received any new reply. Could you please help confirm this confirmation
    thank you

  • Hello Yingjiao,

    I have replied to your request four days ago, please see reply below. 

    Please see answers below.

    1. This is internal information, do you have an NDA with TI?

    2. Currently and in the near future there will be multiple producing origins in production. 

    3. No difference in the wafer, only in origin.

    4. Can you please explain what do you mean by static electricity? Do you mean ESD (electric static discharge)?

    5. There will be no difference in product performance and behavior.

    Thanks,

    Nir