TIDA-010059: Regarding Garber file

Daisuke Higa

Part Number: TIDA-010059
Other Parts Discussed in Thread: TIDA-00915

Hi support team.

I have some questions as below.

1) Is it possible to apply TIDA-010059_Power_BoardE1.G1 to the TOP layer instead of TIDA-010059_Power_BoardE1.GBL?
2) If so, is it through-hole connected to the TOP layer TIDA-010059_Power_BoardE1.GTL via the drilled hole TIDA-010059_Power_BoardE1.TX1?
3) In that case, will the BOTTOM layer TIDA-010059_Power_BoardE1.G1 be glued to the aluminum layer?
4) In that case, is the BOTTOM layer TIDA-010059_Power_BoardE1.G1 and the aluminum layer electrically insulated?

Best regards,

Higa

over 1 year ago

0 Martin Staebler over 1 year ago

TI__Expert 3390 points

Hello Higa,

thank you for your interest in TIDA-010059. I need to check your questions with the designer and get back to you.

Regards,
Martin

0 Jerome Shan over 1 year ago

TI__Intellectual 930 points

Hi Higa,

Please check the details of the IMS (insulated metal substrate) of the board (it is same as the TIDA-00915 board) in this application report (Fig4 and Fig9):

Thermal Comparison of FR-4 and Insulated Metal Substrate PCB for GaN Inverter (ti.com.cn)

Best regards,

Jerome Shan

0 Daisuke Higa over 1 year ago in reply to Jerome Shan

Genius 3635 points

Hi Shan-san

Thank you for your advise.

I have two questions.regarding Gerber files.

Q1.

What is the "TIDA-010059_Power_BoardE1.GBL" file for?
Is it possible to create a board with only the "TIDA-010059_Power_BoardE1.G1" file?

Which file corresponds to the inner L2 layer?

Best regards,

Higa

0 Jerome Shan over 1 year ago in reply to Daisuke Higa

TI__Intellectual 930 points

Hi Higa-san,

1. The .GBL file is for the bottom layer:

In fact, you can see this bottom layer is empty if you open this file. This means the bottom layer does not have any copper.

These are the copper layers (seen in the CAD/CAE file):

2. There is not an inner L2 layer. Only one Mid Layer of G1 exists.

Best regards,

Jerome Shan

0 Daisuke Higa over 1 year ago in reply to Jerome Shan

Genius 3635 points

Hi shan-san

The application note that I received advice from has the following diagram.
It seems that the L2 layer is inside in this diagram.
I'm a little confused about the configuration.
What part of this diagram is the Bottom layer you are talking about?

Also, is it correct that GBL is a single copper layer?

Best regards,

Higa

0 Jerome Shan over 1 year ago in reply to Daisuke Higa

TI__Intellectual 930 points

Hi Higa-san,

It seems that in your diagram, the L1 layer is the Top-copper-layer and the L2 layer is the middle-copper-layer.

From the design (Gerber) file we can see that the bottom layer (the GBL) is an empty layer, and thus no copper is used on this layer in this design.

Best regards,

Jerome Shan

0 Daisuke Higa over 1 year ago in reply to Jerome Shan

Genius 3635 points

Hi shan-san

The attached file is my understanding.
Are the board configuration and associated Gerber files correct?

Best regards,

Higa

5238.Board configuration.pptx

0 Jerome Shan over 1 year ago in reply to Daisuke Higa

TI__Intellectual 930 points

Hi Higa-san,

Your understanding depicted in the attachment is correct.

Best regards,

Jerome Shan

0 Daisuke Higa over 1 year ago in reply to Jerome Shan

Genius 3635 points

Shan-san

Thank you for your kind support.

I understood.

Regards,

Higa

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TIDA-010059: Regarding Garber file