CC1312R7: Firmware and Software Developer on contract requested for Soft Chips(tm) project.

Francis Dacosta

Part Number: CC1312R7

I am Francis daCosta, CTO meshdynamics.

Please see https://meshdynamics.com/Chirp_Primer.html and https://meshdynamics.com/CHIRP/Chirp_Primer_Slides.pdf for overview on this Soft Chips (tm)project.

The main customer is still the military. The intent is to provide deep end to end secure SMS messaging globally. A version was built and tested.

We now want to build a low cost low power version to be produced in millions for military and food systems, and climate preparedness and pollution monitoring etc. Patents awarded and pending. Code exists but needs a full rewrite to work on commercial US based chipsets as part of CHIPS initiative objectives.

Please see use cases here https://meshdynamics.com/Soft_Chips.html

i need details on implementation for my engineers. If TI engineers are not available please point me to where i can find qualified contractors or developers to help me.

The project is funded. We want to use FreeRTOS or Zephyr. Code must be Posix compliant and transportable to other ti devices. We will use CC1312R7, its launch pad and the SensorTags to prove the secure end to end connection from edge to cloud using enterprise customized carrier pigeons and enterprise customized edge devices with UART connections between the two and BLE to BLE paired file transfers between carrier pigeon and connected device e.g smartphone. Please see slides 8,9,10.

francis dacosta 4083737700 fdacosta@meshdynamics.com or fdacosta@gmail.com (preferred)

5 months ago

0 ZC 5 months ago

TI__Genius 11215 points

Hi Francis,

Your best approach here is to contact your local Technical Sales Representative (TSR) in the first instance to discuss this further. I have emailed the TSR associated with your account to facilitate this.

Regards,

Zack

0 Francis Dacosta 5 months ago in reply to ZC

Prodigy 10 points

Thanks Zack- still learning the ropes. Looking forward to meeting with the TSR.

0 Markel Robregado 5 months ago in reply to Francis Dacosta

Guru 85805 points

Hi,

I am technical consultant or contractor with experience in wireless sensor network using TI wireless MCUs. I will send you an email.

-kel

0 ZC 5 months ago in reply to Francis Dacosta

TI__Genius 11215 points

Another option, as well as this thread serving to find consultants (such as above) is to contact one of our module suppliers such as Radiocrafts to discuss implementing the SW changes you need: https://radiocrafts.com/

0 Francis Dacosta 4 months ago in reply to ZC

Prodigy 10 points

Zack how do I find out why TSR is? Thanks

0 ZC 4 months ago in reply to Francis Dacosta

TI__Genius 11215 points

Hi Francis,

I have contacted them and am waiting for a response, it seems they are on leave and will return tomorrow - I am not sure that you are able to do so from your end.

I would also consider contacting Radiocrafts or another suitable module supplier found in:

Third Party Wireless Module Search Tool: https://www.ti.com/tool/3P-WIRELESS-MODULES

However, I will continue to push to get you in contact with TI directly (which is probably a good idea regardless for a large order such as this).

Regards,

Zack

Sub-1 GHz

Sub-1 GHz forum

CC1312R7: Firmware and Software Developer on contract requested for Soft Chips(tm) project.