Frequent Questions

  • [FAQ] Power Dissipation and Temperature

    Back to FAQ Home Page Interface Protection Guides Part Recommendation Packaging & Layout Models Transient Standards System/Device Level Design Power Dissipation and Temperature Top Threads …

  • [FAQ] System/Device Level Design

    Back to FAQ Home Page Interface Protection Guides Part Recommendation Packaging & Layout Models Transient Standards System/Device Level Design Power Dissipation and Temperature Top Threads …

  • [FAQ] Transient Standards

    Back to FAQ Home Page Interface Protection Guides Part Recommendation Packaging & Layout Models Transient Standards System/Device Level Design Power Dissipation and Temperature Top Threads …

  • [FAQ] Models

    Other Parts Discussed in Thread: PSPICE-FOR-TI Back to FAQ Home Page Interface Protection Guides Part Recommendation Packaging & Layout Models Transient Standards System/Device Level Design Power Dissipation…

  • [FAQ] Packaging and Layout

    Back to FAQ Home Page Interface Protection Guides Part Recommendation Packaging & Layout Models Transient Standards System/Device Level Design Power Dissipation and Temperature Top Threads …

  • [FAQ] Part Recommendations

    Back to FAQ Home Page Interface Protection Guides Part Recommendation Packaging & Layout Models Transient Standards System/Device Level Design Power Dissipation and Temperature Top Threads …

  • [FAQ] Which Device Do I Choose If I Need Powered-Off Protection?

    Part Number: TMUX1575 Other Parts Discussed in Thread: SN74CBT3245A , SN74CBT3245C , SN74CBT3861 , SN74CBTLV3861 , SN74CBT3257C , TMUX1574 , , SN74LV4066A , TMUX1511 , TS5A23157 , TMUX1072 System isolation is critical for power sequencing, managing…

  • [FAQ] TDA4VM: Details/information about CPSW instances supported in J7 devices and software supported from TI SDK.

    Part Number: TDA4VM Other Parts Discussed in Thread: DRA829 , , DRA821 , TDA4VL , TDA4VH Details/information about CPSW instances supported in J7 devices and software supported from TI SDK.

  • [FAQ] TDA4VH-Q1: Extending SDL CCM example to the Main Domain R5Fs

    Part Number: TDA4VH-Q1 Currently the SDL CCM test caters only to MCU domain R5Fs. Provide the steps to port the SDL cpu_app to perform CCM on the Main Domain R5Fs.

  • [FAQ] TUSB2E11: What is the optimal location for an eUSB repeater on my PCB?

    Part Number: TUSB2E11 The eUSB2 interface is becoming increasingly common in designs with advance processors. In order to enable backwards compatibility with USB 2.0 hosts and devices, an eUSB2 repeater must be placed between the processor and the USB…

View FAQ threads
Recommended For You