Frequent Questions

  • [FAQ] AM62A3 / AM62A3-Q1 / AM62A1-Q1 Custom board hardware design – Collaterals to Get started

    Part Number: AM62A3 Other Parts Discussed in Thread: AM62D-Q1 , , AM62A7-Q1 , , AM62A7 , SK-AM62A-LP , SYSCONFIG , AM62P , AM2432 Hi TI Experts, Can you provide a List of collaterals that can be referred when starting a custom board hardware design…

  • [FAQ] TDA4VM: How to do a MAC loopback test with CPSW in TDA4/DRA8 devices

    Part Number: TDA4VM There is some issue in my ethernet link. I wanted to do a sanity check using MAC loopback and see if the MAC is working well or not. Is there an easy way to do this?

  • [FAQ] AM62A7 / AM62A7-Q1 Custom board hardware design – Collaterals to Get started

    Part Number: AM62A7 Other Parts Discussed in Thread: AM62D-Q1 , AM62A3 , , AM62A3-Q1 , , SK-AM62A-LP , SYSCONFIG , AM62P , AM2432 Hi TI Experts, Can you provide a List of collaterals that can be referred when starting a custom board hardware design…

  • [FAQ] TDA4VM: What are the changes required to fit boot images within 4MB of emmc boot partition ?

    Part Number: TDA4VM What are the changes need to be done in order to fit the boot images within 4MB if the emmc boot partition size is 4MB.

  • [FAQ] Does TI offer engineering model (/EM) versions of the rad-hard -SP & rad-tolerant -SEP space-grade devices?

    {ANS} For a number of our most popular QML Class-V radiation-hardened ceramic packaged devices (denoted with the -SP at the end of the part number) TI does offer engineering model ”/EM” versions and if these /EM parts are available you can find these…

  • [FAQ] AM6442/AM243: How to use the TISCI APIs (READ_KEYCNT_KEYREV & WRITE_KEYREV) to activate the backup key set

    Part Number: AM6442 This FAQ showcase how to use the following TISCI APIs in AM64x/AM243x MCU+SDK - TISCI_MSG_READ_KEYCNT_KEYREV - TISCI_MSG_WRITE_KEYREV

  • [FAQ] What is the thickness of Gold (Au), Palladium (Pd), or Nickel (Ni) for TI's NiPdAu lead finish?

    FAQ: Logic and Voltage Translation > Quality and Manufacturing >> Current FAQ Material Thickness Å nm μm Nickel (Ni) 5000 500 0.5 Palladium (Pd) 200 20 0.02 Gold (Au) 30 to 150 3 to 15 0.003 to…

  • [FAQ] AM6x: Using multilib to allow running 32-bit binaries on Yocto Dunfell-based v8.x SDKs for Sitara 64-bit MPUs

    Part Number: AM62x Overview Multilib is one of the solutions allowing users to run applications built for various application binary interfaces (ABIs) of the same architecture. One use of this is to run 32-bit applications built for older generation…

  • [FAQ] TLV9001: What does the "Z" Designator in TLV9001ZIDPWR mean?

    Part Number: TLV9001 TLV9001 Z IDPWR and TLV9001IDPWR both exist as orderable part numbers under the TLV9001 product page. What is the difference between the two devices?

  • [FAQ] AM6x/AM335x/AM437x: Using a Yocto-internal toolchain for target image builds and cross-development SDK installer generation with Yocto Dunfell-based v8.x SDKs for Sitara MPUs

    Overview This E2E FAQ shows an alternative approach of how to use an Yocto-internal toolchain for image builds as well as for the associated SDK installer generation that contains the cross-toolchain and the image-specific target sysroot (libraries…

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