Hi TI community,
sorry to bother you with a most probably stupid question ...
For my actual design I am planning to use the amplifier THS7002. But I get confused about the connection of the thermal pad. The PowerPad design considerations recommend the connection to the "internal ground plane".
Is this the same net as "GND-A" and "GND-B" or should the PowerPad have no connection to any pin?
Thanks in advance and best regards,
Gerald