Part Number: TDA4VM-Q1 Other Parts Discussed in Thread: TDA4VM During boot or reboot, seeing the following error logs, or similar when using PCIe in the system: ITS queue timeout (8896 8832) / ITS cmd its_build_mapd_cmd failed ... or related GIC…

Part Number: AM62L Other Parts Discussed in Thread: SYSCONFIG , UNIFLASH The AM62L OTP Keywriter is a new keywriter package for AM62L devices. While the programmable eFuse fields and X.509 certificate structure are largely the same as the AM62x OTP…

Part Number: AM2612-Q1 Other Parts Discussed in Thread: SYSCONFIG Hi expert, Please provide ways the SBL Image size can be reduced.

Other Parts Discussed in Thread: SYSCONFIG The System Firmware (SYSFW) on AM64x and AM243x devices supports a Security Handover mechanism, which controls the transfer of security ownership between SYSFW and the application host. The full feature description…

Part Number: AM6442 Prior the SDK version v1 This FAQ discusses the steps to enable the MCELF encrypted boot in the MCU+ SDK v12.01.00.33 for AM64x and AM243x devices.

Part Number: AM2612-Q1 Other Parts Discussed in Thread: UNIFLASH Hi expert, Please provide steps to flash AM261 using UniFlash CLI tool. Provide commands for relevant operations as well

Part Number: MSPM33C321A Other Parts Discussed in Thread: UNIFLASH , SYSCONFIG 1. Background For bank swap, what really swapped is the address of bank0 and bank1. However for MSPM33C321A, not only MAIN FLASH but also NONMAIN FLASH will swap the…

Part Number: TDA4AEN-Q1 How to flash to OSPI using DFU in TDA4AEN/TDA4VEN/J722S?

Part Number: TDA4VH-Q1 Other Parts Discussed in Thread: TDA4VL , TDA4VM , TDA4VH What data throughput can be achieved on TDA4 device in theory, and what throughput can be measured? And how to achieve measured throughput?

Part Number: F29H859TU-Q1 Hi experts, Is it possible to write to CPU3 flash region from CPU1 in bank mode3. If so how to do this? Please provide example on how to do this.