OPA4187: OPA4187IPW - NiPdAu terminal finish substance thickness

Hi Jasmine, 

Can you please provide the thickness of each substance found in the NiPdAu terminal finish of part OPA4187IPW ?

NiPdAu coatings are deposited via electrolytic chemical process, and the coating thickness is approx. from 1.5um to 5.7um. 

Is the thickness composition for this part the same for all TI parts that come in TSSOP-14 package?

Fairly close in the range presented in the table below.  Due to the electroplating process, the coating thickness is difficult to control precisely, but specified in the ranges in the table below (because of the various deposition variables of the electrochemical process). 

Is it the same for all NiPdAu terminal finish TI parts? 

I believe that all NiPdAu Gold-Plated Termination-finishes are the same. The chemical plating composition is shown in the captured image below. 

https://www.ti.com/materialcontent/en/report?pcid=248780&opn=OPA4187IPWR

Are there any exceptions?

Not I am aware of for the OPA4187. Typically it should be specified in the Component Information of a given part, see the link above.  

If you have additional questions, please let me know. 

Best,

Raymond

Hi Raymond,

More specifically, can you provide the thickness range of each the Pd and Au within the NiPdAu finish for OPA4187IPW?

Thanks,

Jasmine

Hi Jasmine, 

Please give me several days to get the process information for you. You want to know Palladium and Au coating thickness ranges og the lead frame plating process. 

Best,

Raymond

Hi Jasmine, 

My coating thickness figures presented in the table below are incorrect. This is a different process from a different coating stack.  

All TI's NiPdAu lead frame coating thickness is based on the following application report, where the film stack thickness are shown. 

https://www.ti.com/lit/an/szza031/szza031.pdf?ts=1658841766846&ref_url=https%253A%252F%252Fwww.google.com%252F

If you have additional questions, please let me know. 

Best,

Raymond