SM73302: Ball composition

Kota Morihara

Intellectual 630 points

Part Number: SM73302

Customers have asked the following questions to register their products. Can you give me more details?

Material: SM73302MFX/NOPB

1. Use Ni for grounding or not. : Yes / No

2. Thickness of outermost layer plating :　10 μm or more / Less than 10 μm

3. Heat treatment such as annealing or not : Yes / No

Your prompt support would be highly appreciated, thank you!

12 months ago

0 Clemens Ladisch 12 months ago

Guru 257270 points

See ti.com/quality-reliability-packaging-download/report?opn=SM73302MFX/NOPB. The lead frame plating is pure tin.

Lead finish composition & Tin plating process says that there is annealing.

0 Kota Morihara 12 months ago in reply to Clemens Ladisch

Intellectual 630 points

Thank you for your reply.

I was able to confirm the annealing process, but
I didn't know the Ni base and plating thickness.
Can you give me more details?

0 Alec Saebeler 11 months ago in reply to Kota Morihara

TI__Genius 12855 points

Hello Kota,

I can provide assurance there is not Ni present in the materials list for the SM73302MFX/NOPB. Viewing the report, it appears for this Pb-free device the lead finish would be Matte Sn, not any of the Ni/Ag/Au/Cu alloys.

If you are particularly concerned with the solder balls, the two lead-free compositions are SnAg and SnAgCu.

The lead frame plating contains 0.7mg of Sn; I cannot provide the plating thickness yet. I will look into that information.

Best,

Alec

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SM73302: Ball composition