This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

NEED INFORMATION- OPA2277U/2K5G4

Hi Can you please provide the following information for the OPA2277U/2K5G4 Part ?

1. Junction Temperature Max (Tj Max)

 2. Typical Power dissipation (Pd typ)

3. Maximum Power dissipation (Pd max)

4. Thermal Resistance Junction to Ambient (Theta JA

5. Thermal Resistance Junction to Board (Theta JB)

6. Thermal Resistance Junction to Case (Theta JC)

7. Weight

Regards,

Jayakumara K

jayakumara.krishnasetty@honeywell.com

Tel:   +91-80-26588360   Extn: 50116

Honeywell Technology Solutions Labs Pvt Ltd.,

  • Hi Jayakumara,

    Thank you for your inquiry.

    For #5, #6 and #7, I am afraid it will take two weeks to answer.

     

     1. Junction Temperature Max (Tj Max) 

     Although absolute Max is 150[C], we estimate Ti Max as follws.

     Supply voltage = +/-15V, short circuit to GND  current is about 25mA (as shown in the spec sheet, page6)

      Pd = 15V x 25mA = 375mW

      Tj(Max) = Pd (Max) x ThetaJA + Ta(Max) = 375mW x 100C/W + 85C = 122.5C

     

     2. Typical Power dissipation (Pd typ)

     In condition of supply voltage = +/-5V, RL=2kohm, Vout=+/-3.5V (as shown in the spec sheet, page4) 

      a) power of Iq

          (+5v - (-5v)) x 0.79mA = 7.9mW

      b) power of output

          Output current is 3.5V / 2kohm = 1.75mA.

           ( 5V - 3.5V ) x 1.75mA = 2.6mW

      a) + b) = 10.5mW

     

     3. Maximum Power dissipation (Pd max) 375 [mW] ( as calculated above )

     4. Thermal Resistance Junction to Ambient (Theta JA) 100 [C/W] (as shown in the spec sheet, page4) 

     5. Thermal Resistance Junction to Board (Theta JB)

     6. Thermal Resistance Junction to Case (Theta JC)

     7. Weight

     

    Best regards,

     Ichiro Itoi

     

  • Hi Jayakumara,

    Here is the answer for #4, #5, #6 and #7.

     4. Thermal Resistance Junction to Ambient (Theta JA)

            SPEC SHEET: 150 [C/W] (as shown in the spec sheet, page4, SO-8 Surface-Mount) 

           Simulation: 91.9 [C/W]

     5. Thermal Resistance Junction to Board (Theta JB) simulation: 40.6 [C/W]

     6. Thermal Resistance Junction to Case (Theta JC) (top) simulation: 39.9 [C/W]

     7. Weight: 85.1 [mg]

         http://focus.ti.com/quality/docs/searchbyopn.tsp?templateId=5909&navigationId=11220&orderablePartNo=OPA2277U/2K5G4&pnType=A

    Best regards,

     Ichiro Itoi