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OPA2376: About mechanical stability of VSSOP package

Tsukui Yusuke
Guru 21930 points
Part Number: OPA2376

Hi,

Let's talk about OPA2376 VSSOP package.

Customer is designing an application using OPA2376.
And They plans to cover the OPA2376 with a heat dissipation sheet to prevent heat generation.
In the background, a stress of 1.2 MPa is applied from the top of the IC to the board.
Customers want to know information about mechanical strength of VSSOP package for application design.

Could you tell me the mechanical strength target value of TI's VSSOP package?



Regards,
Yusuke

  • 0
    TI__Guru 62700 points

    Yusuke,

    Here is the info I received: 

    We have data on HTSSOP on another gullwing leaded package in SOP family,  but not on 8-lead VSSOP.  Based on HTSSOP data (enclosed) and scaling back to VSSOP package size, it seems the 1.2MPa is OK.

    Having said that, OPA2376 is a precision package-level trimmed part.  While applying pressure of 1.2MPa to the package seems fine, it must be understood that mechanical stress may result in the shift of the input voltage offset and drift, and thus under such conditions the OPA2376 may NOT meet datasheet specified limits.