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Package roadmap for OPAMP's

Other Parts Discussed in Thread: OPA2387, OPA2145, OPA2607, TLV9042, OPA2182, TLV9152, TLV9352

Hi,

I wonder what the plans of TI (or the semiconductor industries in general) are concerning the future of OPAMP packages (dual channel OPAMP). So far SOIC8 is a widely used package with lots of second source options. But on the other hand it is quite big and takes a lot of PCB space. I'm aware of VSSOP8 and WSON8. Now the question is which small package will be the one that is used the most in the future.
Any plans that the SOIC8 package will be replaced by VSSOP8 or WSON8 on new OPAMPS?
Is VSSOP8 a good choice?

I know that this might not be a question to have an easy answer but maybe there is a consens that one package is more used than the other or has more technological possibilities.

Looking forward to any feedback on this topic.

Thanks and best regards,

Patrick

  • Recently introduced dual opamps:

    OPA2387: VSSOP
    OPA2145: SOIC, VSSOP
    OPA2607: SOIC, VSSOP
    TLV9042: SOIC, VSSOP, TSSOP, SOT-23-THIN, WSON, X2QFN
    OPA2182: SOIC, VSSOP
    TLV9152: SOIC, TSSOP, SOT-23-THIN, WSON, X2QFN
    TLV9352: SOIC, TSSOP, SOT-23-THIN

  • Hi Patrick,

    Certainly the trend is for smaller packages and many new products are introduced in smaller packages but are also offered in SOIC(8) because of its popularity and demand.

    I cover a few of the devices you have on the list, the OPA2145 and OPA2182. Both of these are offered in the SO8 as you have noted, but are also available in the smaller VSSOP(8). I checked other op amps on you list. The OPA2607 is not only available in the VSSOP(8) but the X2QFN(10) as well. And the OPA2387 is available in the VSSOP(8) and DFN(8).

    Like the DIP packages the SOIC(8) will eventually be replaced by ever smaller packages. As semiconductor process evolve further and the die shrink the packages will follow.

    Regards, Thomas

    Precision Amplifiers Applications Engineering