Layout Question for the CDCM7005-SP (Ground pad with thermal vias)

David Durachka

Good afternoon,

I have a question regarding the layout for the CDCM7005-HFG package. I can't find a good reference for the ground pad that should be placed under the part, the datasheet makes reference to it but doesn't provide any specific guidelines. Where can I find this information? (I am looking for the ground pad specs for the 52-pin package)

Dave

over 9 years ago

0 Gabe Ayala over 9 years ago

TI__Genius 10320 points

Hi Dave,
Per the DS, the junction to free air thermal resistance is calculated based on nine thermal vias arranged in a grid, each with 0.3mm diameter. This however is not necessarily the best layout for thermal dissipation/isolation. My recommendation would be to follow the layout shown in the CDCM7005-HFG EVM here: www.ti.com/.../sglu007.pdf

Gabe

Clock & timing

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Layout Question for the CDCM7005-SP (Ground pad with thermal vias)