AM26LS31: AM26LS31

Ewe Hin Ong

Part Number: AM26LS31

From product datasheet AM26LS31, for part rated 0'C to 70'C operating condition which is using copper wire, can it pass High Temperature Operating Life test, HTOL125'C, 1000 hours and Temperature Cycle, TMCL -65'C/150'C, 500 cycles reliability test?

over 4 years ago

0 Ewe Hin Ong over 4 years ago

Prodigy 10 points

The part number is AM26LS31C and AM26LS31CD

0 Eric Hackett over 4 years ago in reply to Ewe Hin Ong

TI__Guru 74302 points

Ewe,

I'll let the RS485 expert comment as well, but given the limited operating condition temperature range, it's unlikely that this device was quality tested to 125C and 150C. Since these are older devices we'll have to dig around for the quality testing information, but more than likely they won't fare well in long term high temperature testing.

Regards,

Eric Hackett

0 Hao L over 4 years ago in reply to Ewe Hin Ong

TI__Mastermind 25705 points

You can find the quality summary at this TI site.

Qualification summary

I attach the summary for your reference. AM26LS31CDBR-11989376.pdf

0 Ewe Hin Ong over 4 years ago in reply to Hao L

Prodigy 10 points

Thanks, Hao. From the qualification summary for AM26LS31CDBR which is also Commercial part (0C to 70'C), the part passed 1000 hours HTOL 125'C and 500 cycles TMCL -65/150'C. Is this based on Copper wire bonding? What is the mold compound type?

0 Ewe Hin Ong over 4 years ago in reply to Eric Hackett

Prodigy 10 points

Hi Eric,

Thanks for the reply. That's why I want to confirm with TI experts

0 Hao L over 4 years ago in reply to Ewe Hin Ong

TI__Mastermind 25705 points

Yes, the device has Cooper wire bond. I'm sorry the mold compound type is "TI information", which can not be shared on public forum. However for more material content, please check out this report posted on ti.com: https://www.ti.com/materialcontent/en/report?pcid=8196&opn=AM26LS31CDBR

Interface

Interface forum

AM26LS31: AM26LS31