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Original question:

TLK2711-SP: CAD footprint / advise how to handle the leads

TLK2711-SP: question about lead forming data used for TLK2711EVM-CVAL

Jeroen van der Velden
Prodigy 140 points
Part Number: TLK2711-SP

Hi TI,

I found the figures below in this thread: https://e2e.ti.com/support/legacy_forums/hirel/f/space-high-reliability-forum-read-only/719646/tlk2711-sp-request-the-layout-lead-forming-data

The question I have is: Why is there a gap/distance shown beween the bottom of the device and the bottom of the leads, indicated by symbol "A"? As the device has a thermal pad, I would expect "A" to be zero. Is this gap required to account for the solder paste thickness?

Many thanks and best regards, 

Jeroen

  • 0
    TI__Mastermind 20707 points

    Hi Jeroen,

    Unfortunately, I do not have a definitive answer to your question.  However, I believe that you provided a good explanation as to why there is a gap.  Another factor that might contribute to this gap could be lead forming tolerances.  If there is tolerance in the lead height relative to the thermal pad, it would be important to ensure that the leads sit far enough "below" the thermal pad in order to make good contact with the board.  This could be accomplished by leaving a small height difference between the leads and thermal pad in order to ensure that leads make good contact with the PCB.

    Thanks,

    Drew