Input Parameters | Output Parameters | |||
Power and Thermals | Timing Parameters | Logic Technology | Quality and Manufacturing | Simulation Models |
- [FAQ] Why does a logic device's part number have an E4/G4 suffix?
- [FAQ] When will TI End of Life (EOL) or Obsolete a certain logic device?
- [FAQ] Are there voltage level translation / level shifter device recommendations for the industry standard interfaces like GPIO, SPI, UART, I2C, MDIO, RGMII, I2S etc?
- [FAQ] Why do the leadframes look strongly oxidized or corroded?
- [FAQ] What do the underside markings on a part mean?
- [FAQ] What is the difference between TXS TXB and LSF devices?
- [FAQ] What are the RHA numbers, codes or radiation testing ratings for my high reliability part number?
- [FAQ] How do I find reliability data for a logic device?
- [FAQ] Is part number X pin to pin compatible with part number Y?
- [FAQ] How do I set up a TI.com device re-stock notification?
- [FAQ] Where can I get a CAD symbol, soldering footprint, or 3D model for my device?
- [FAQ] How will a logic device respond to a short or open circuit?
- [FAQ] Why do some SOT package parts from TI have a pin that is not in the mechanical drawing?
- [FAQ] What is the thickness of Gold (Au), Palladium (Pd), or Nickel (Ni) for TI's NiPdAu lead finish?