Other Parts Discussed in Thread: AM6412, AM6422, , AM2434, TPS65220, TPS65219, SK-AM64B, TMDS64EVM, AM6411, AM6421, AM6441
Hi TI Experts,
Can you provide a List of collaterals that can be referred when starting a custom board hardware design.
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Hi Board designers,
The below links are a quick reference to the collaterals that can be referred when starting a custom design.
Device Selection and features
Product Pages
https://www.ti.com/product/AM6442
https://www.ti.com/product/AM6441
https://www.ti.com/product/AM6422
https://www.ti.com/product/AM6421
https://www.ti.com/product/AM6412
https://www.ti.com/product/AM6411
Datasheet
AM64x Sitara Processors datasheet
https://www.ti.com/lit/pdf/sprsp56
Silicon Errata
AM64x/AM243x Processor Silicon Revision 1.0, 2.0
https://www.ti.com/lit/pdf/sprz457
Technical Reference Manual
AM64x /AM243x Processors Technical Reference Manual
https://www.ti.com/lit/pdf/spruim2
Custom Board design:
Hardware Design Considerations
Hardware Design Considerations for Custom Board Using AM6442 , AM6422 , AM6412 and AM2434 Processors
https://www.ti.com/lit/pdf/sprad67
Schematic Design and Review Checklist
AM6442 , AM6422 , AM6412 and AM2434 Processor Schematic Design Guidelines and Schematic Review Checklist
https://www.ti.com/lit/pdf/spracu5
Power Consumption
AM64x Maximum Current Ratings
https://www.ti.com/tool/download/SPRR451
AM64x/AM243x Power Estimation Tool
https://www.ti.com/lit/pdf/spracw6
SoC power solutions Application notes:
Powering the AM64x with the TPS65220 or TPS65219 PMIC
https://www.ti.com/lit/pdf/slvafe9
Evaluation - EVM
https://www.ti.com/tool/SK-AM64B
SK-AM64B Design File Package
https://www.ti.com/lit/zip/sprr460
https://www.ti.com/tool/TMDS64EVM
TMDS64EVM Design File Package
https://www.ti.com/lit/zip/sprr462
Add-on cards
GPMC NAND Expansion Card
HSE NAND EXP BOARD + BREAKOUT BOARD.zip
PinMux
CAD symbols
Cad symbol specific to the selected device can be chosen from the device product page. Refer below example:
https://www.ti.com/product/AM6442#cad-cae-symbols
Ordering & quality
https://www.ti.com/product/AM6442#order-quality
https://www.ti.com/product/AM6441#order-quality
https://www.ti.com/product/AM6422#order-quality
https://www.ti.com/product/AM6421#order-quality
https://www.ti.com/product/AM6412#order-quality
https://www.ti.com/product/AM6411#order-quality
Package pad diameter and substrate pad dimension
AM64x -> ALV pkg : ball diameter 0.5mm : substrate pad 0.45mm
The recommendation is 1:1 ratio between PCB pad and substrate pad.
Lead finish/Ball material
SnAgCu
DDR Board Design and Layout Guidelines
AM64x\AM243x DDR Board Design and Layout Guidelines
https://www.ti.com/lit/pdf/spracu1
Escape Routing for PCB Design
AM64x and AM243x BGA Escape Routing
https://www.ti.com/lit/pdf/spruiy5
Design Simulation files
https://www.ti.com/product/AM6442#design-tools-simulation
Simulation files provided includes IBIS, IBIS-AMI, BSDL, Thermal model, power-estimation tool (PET) and Maximum Current Ratings.
IBIS model
https://www.ti.com/lit/zip/sprm730
Thermal model attached in case the thread is not accessible.0268.sprm773a.zip
(23) AM6442: Ansys Compatible Thermal Model - Processors forum - Processors - TI E2E support forums
AM64x PDN Target impedance values:
Impedance target values for VDD_CORE on AM64x
Low freq (< 1MHz): 15 mOhm
Mid freq (1 < 20MHz): 35 mOhm
High freq (20 < 50 MHz): 35 mOhm
This is valid for either of the core voltage voltages (0.75V, 0.85V). We do not provide target impedance values for other rails on AM64x.
Note: We do not include Buck output inductance in PDN simulations.
Power Distribution Networks: Implementation and Analysis
Sitara Processor Power Distribution Networks: Implementation and Analysis
https://www.ti.com/lit/pdf/sprac76
High Speed Board design and Signal integrity simulation
https://www.ti.com/lit/pdf/spraar7
https://www.ti.com/lit/pdf/spracn9
https://www.ti.com/lit/pdf/sprabi1
Technical Documents
Collaterals and application notes
https://www.ti.com/product/AM6442#tech-docs
Technical Support
AM6442, AM6441, AM6422, AM6421, AM6412, AM6411 Custom board design - FAQs
Previous E2E threads - Keywords AM64x, AM644X, AM6442, AM6441, AM6422, AM6421, AM6412, AM6411
Starting a new thread
Useful links
Notes
Regards,
Sreenivasa
Hi Board designers,
Configuring Hysteresis
Data sheet
6.3.10 GPIO
6.3.10.1 MAIN Domain
Table 6-35. GPIO0 Signal Descriptions
(1) This GPIO input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.
6.3.10.2 MCU Domain
Table 6-37. MCU_GPIO0 Signal Descriptions
TRM
5.1.1.3.1.1 Pad Configuration Registers
The pad configuration registers are used to configure most of the device pads. Each pad configuration register
(PADMMR_PADCONFIG0 to PADMMR_PADCONFIG181) is assotiated only with one pad and has bits as
described in Table 5-4.
Regards,
Sreenivasa
Hi Board designers,
Inputs regarding board simulation
Refer below for the AC Impedance plot for VDD_CORE.
The board has undergone full split lot validation with this combination of filtering/decaps.
Regards,
Sreenivasa