[FAQ] AM6442, AM6441, AM6422, AM6421, AM6412, AM6411 Custom board hardware design – Collaterals to Get started

Hi Board designers, 

The below links are a quick reference to the collaterals that can be referred when starting a custom design.

Device Selection and features

Product Pages

https://www.ti.com/product/AM6442

https://www.ti.com/product/AM6441

https://www.ti.com/product/AM6422

https://www.ti.com/product/AM6421

https://www.ti.com/product/AM6412

https://www.ti.com/product/AM6411

 Datasheet

AM64x Sitara Processors datasheet

https://www.ti.com/lit/pdf/sprsp56

Silicon Errata

AM64x/AM243x Processor Silicon Revision 1.0, 2.0

https://www.ti.com/lit/pdf/sprz457

Technical Reference Manual

AM64x /AM243x Processors Technical Reference Manual

https://www.ti.com/lit/pdf/spruim2

Custom Board design:

Hardware Design Considerations

Hardware Design Considerations for Custom Board Using AM6442 , AM6422 , AM6412 and AM2434 Processors

https://www.ti.com/lit/pdf/sprad67

Schematic Design and Review Checklist

AM6442 , AM6422 , AM6412 and AM2434 Processor Schematic Design Guidelines and Schematic Review Checklist

https://www.ti.com/lit/pdf/spracu5

Power Consumption

AM64x Maximum Current Ratings

https://www.ti.com/tool/download/SPRR451

AM64x/AM243x Power Estimation Tool

https://www.ti.com/lit/pdf/spracw6

SoC power solutions Application notes:

Powering the AM64x with the TPS65220 or TPS65219 PMIC

https://www.ti.com/lit/pdf/slvafe9

Evaluation - EVM

TMDS64EVM Design Package Folder and Files List
www.ti.com/.../TMDS64EVM
https://www.ti.com/lit/pdf/sprt782

TMDS64EVM Design File Package

https://www.ti.com/lit/zip/sprr462 

SK-AM64B Design Package Folder and Files List
www.ti.com/.../SK-AM64B
https://www.ti.com/lit/pdf/sprt783

SK-AM64B Design File Package

https://www.ti.com/lit/zip/sprr460

Add-on cards 

Schematics (Reference) for RMII interface 

PROC135E1_SCH.pdf

PROC156E1_SCH.pdf

RMII_Length_Matching.xlsx

Note:  We did functionally validate the common clock configuration. No other clocking options were tested. 

Ethernet PHY daughter card 
https://www.ti.com/tool/DP83867-EVM-AM

https://www.ti.com/tool/DP83826-EVM-AM2

https://www.ti.com/tool/TIDA-00928

GPMC NAND Expansion Card 

HSE NAND EXP BOARD + BREAKOUT BOARD.zip

here seems to be a muxed GPMC interface implemented.
https://media.digikey.com/pdf/Data%20Sheets/Texas%20Instruments%20PDFs/TMDXICE3359_SCH.pdf

PinMux 

4442.am64x_sk.zip

am64x_evm.zip

CAD symbols

Cad symbol specific to the selected device can be chosen from the device product page. Refer below example:

https://www.ti.com/product/AM6442#cad-cae-symbols

Ordering & quality

https://www.ti.com/product/AM6442#order-quality

https://www.ti.com/product/AM6441#order-quality 

https://www.ti.com/product/AM6422#order-quality 

https://www.ti.com/product/AM6421#order-quality 

https://www.ti.com/product/AM6412#order-quality 

https://www.ti.com/product/AM6411#order-quality 

Package pad diameter and substrate pad dimension 

AM64x -> ALV pkg : ball diameter 0.5mm : substrate pad 0.45mm
The recommendation is 1:1 ratio between PCB pad and substrate pad.

Lead finish/Ball material

SnAgCu

DDR Board Design and Layout Guidelines

AM64x\AM243x DDR Board Design and Layout Guidelines

https://www.ti.com/lit/pdf/spracu1

Escape Routing for PCB Design

AM64x and AM243x BGA Escape Routing

https://www.ti.com/lit/pdf/spruiy5

Design Simulation files

https://www.ti.com/product/AM6442#design-tools-simulation

Simulation files provided includes IBIS, IBIS-AMI, BSDL, Thermal model, power-estimation tool (PET) and Maximum Current Ratings.

IBIS model

https://www.ti.com/lit/zip/sprm730

Thermal model attached in case the thread is not accessible.0268.sprm773a.zip

 (23) AM6442: Ansys Compatible Thermal Model - Processors forum - Processors - TI E2E support forums

0268.sprm773a.zip

Layer Stackup 

TMDS64EVM_PROC101_Stack_up.pdf

AM64x PDN Target impedance values:

Impedance target values for VDD_CORE on AM64x

Low freq (< 1MHz): 15 mOhm

Mid freq (1 < 20MHz):  35 mOhm

High freq (20 < 50 MHz): 35 mOhm

This is valid for either of the core voltage voltages (0.75V, 0.85V). We do not provide target impedance values for other rails on AM64x.

For frequencies above 50 MHz the board decoupling caps do not play a critical role. SoC and Package decaps (if any) will be dominant beyond 50 MHz

Note:

We do not include Buck output inductance in PDN simulations.

For VDDS_DDR: we do not recommend using target impedance as the signoff for DDR.

AM62x, AM62Lx DDR Board Design and Layout Guidelines

https://www.ti.com/lit/pdf/sprad06

Refer to the AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines

The DDR design guidelines outlines all details of power aware SI/PI simulations
that need to be run. The eye mask checks from these power aware simulations are the signoff.

Power Distribution Networks: Implementation and Analysis

Sitara Processor Power Distribution Networks: Implementation and Analysis

https://www.ti.com/lit/pdf/sprac76

High Speed Board design and Signal integrity simulation 

https://www.ti.com/lit/pdf/spraar7

https://www.ti.com/lit/pdf/spracn9

https://www.ti.com/lit/pdf/sprabi1

Technical Documents

Collaterals and application notes

https://www.ti.com/product/AM6442#tech-docs

Technical Support

AM6442, AM6441, AM6422, AM6421, AM6412, AM6411 Custom board design - FAQs

Previous E2E threads - Keywords AM64x, AM644X, AM6442, AM6441, AM6422, AM6421, AM6412, AM6411

Starting a new thread

(2) TI E2E support forums

Useful links

Sitara family of processors FAQ master list 

https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1395812/faq-custom-board-hardware-design---master-complete-list-of-faqs-for-all-sitara-processor-am62x-am64x-am243x-am335x-families

Other FAQs

https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1347060/faq-am6442-am6441-am6422-am6421-am6412-am6411-custom-board-hardware-design---design-and-review-notes-for-reuse-of-sk-am64b-schematics

https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1337853/faq-am6442-am6441-am6422-am6421-am6412-am6411-custom-board-hardware-design---design-and-review-notes-for-reuse-of-tmds64evm-schematics

SOC POH
https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1492996/am620-q1-the-definition-of-power-of-hour-for-automotive-grade/5736233#5736233

Notes

1. Always ensure you are using the latest version of the documentation.
2. Check the product folder regularly for the latest version.
3. On Ti.com, device product folder page, there is a "Notifications" button. Registering here enables automatic notification of device document changes.
4. If you have any queries or clarification, use E2E to find similar queries or ask a new question

Regards,

Sreenivasa

Hi Board designers,

Inputs regarding board simulation

Refer below for the AC Impedance plot for VDD_CORE.

The board has undergone full split lot validation with this combination of filtering/decaps.

Regards,

Sreenivasa

Hi Board designers,

Inputs regarding Package shelf life

https://e2e.ti.com/support/processors-group/processors/f/processors-forum/1520415/am625-package-shelf-life

Please refer below links

https://www.ti.com/support-quality/quality-policies-procedures/product-shelf-life.html

https://www.ti.com/support-quality/faqs/product-shelf-life-faqs.html

https://www.ti.com/packaging/docs/mslsearch.tsp?OPN=AM6254BTGFHIAMCRQ1&searchSelected=devpartno&searchkey=AM625#divline

https://www.ti.com/support-quality/reliability/reliability-home.html

https://www.ti.com/lit/an/spraby1a/spraby1a.pdf

https://www.ti.com/lit/pdf/snoa550

https://www.ti.com/lit/an/slva840/slva840.pdf

/cfs-file/__key/communityserver-discussions-components-files/791/Baking-Procedure.pdf

Regards,

Sreenivasa